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G. Indars consults on lapping, polishing, wafering, dicing and cutting of all materials including ceramics, quartz, glass, sapphire and metals, Services include ...
abrasives consultant  anodic bonding  ceramic joining  crystal wafering  diamond compound consultant  dicing consultant  laser slag removal  optical finish  polishing consultant  quartz and glass machining  silicon wafering  substrate polishing  wafering consultant 
www.indars.com - 2009-02-04
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Silicon Wafer, Ultra Thin Silicon, ultra thin wafer, ultra thin wafers, for research and production
back lapping  nanogrind  nanogrinding  silicon lapping  thinner wafer  thinner wafers  thinning service  thinning services  Ultra-Flat Substrates  ultra thin silicon  ultra thin wafer  ultrathin wafer  ultra thin wafers  Uniform Thickness Wafers  wafer backgrind  wafer polisher 
www.ultrathinwafers.com - 2009-02-07
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ultra thin wafers
ultra thin silicon
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thinning services
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